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Factory capability
Process
Item
Process Capability
Base Information
Production Capability
Layer count 1-30 layers (Quick Turn PCB)
Bow and twist 0.75% standard, 0.5% advanced
Min. finished PCB size 10 x 10mm(0.4 x 0.4")
Max. finished PCB size 530 x 1200mm(20.9 x 47.24 ")
Multi-press for blind/buried vias Multi-press Cycle≤3 times
Finished board thickness 0.3 ~ 7.0mm(8 ~ 276mil)
Finished board thickness tolerance +/-10% standard, +/-0.1mm advanced
Surface finish HASL, Lead free HASL, Flash gold, ENIG, OSP, Immersion Tin, Immersion silver, Hard gold plating, Carbon, etc
Selective surface finish ENIG+OSP, ENIG+Gold finger, Flash gold+HASL,
Material Type
High Tg material S1170(Shengyi Tg>170℃)
Impedance Control Material FR4, FR4 High Tg series
RCC material Copper foil thickness 12um, Dielectric Thickness 65,80,100um(55,70,90um after pressing)
Copper foil 1/3oz ~ 8oz
Prepreg Type
FR4 Prepreg, LD-1080(HDI) 106, 1080, 3313, 2313, 2116, 7628
Reliable Test
Peel strength 7.8N/cm
Fammability 94V-0
Ionic contamination ≤1ug/cm²
Min. dielectric thickness 0.075mm(3mil)
Impedance tolerance +/-10% for impedance ≥50Ω, +/-5Ω for impedance ≤50Ω
Inner layer&Outer layer Image Transfer
Machine Capability
Scrubbing Machine Material thickness: 0.11 ~ 3.2mm(4.33mil ~ 126mil)
Material size: min. 228 x 228mm(9 x 9")
Laminator, Exposer Material thickness: 0.11 ~ 6.0mm(4.33 ~ 236mil)
Material size: min 203 x 203mm(8 x 8"), max. 609.6 x 1200mm(24 x 30 ")
Etching Line Material thickness: 0.11 ~ 6.0mm(4.33mil ~ 236mil)
Material size: min. 177 x 177mm(7 x 7")
Inner layer Process Capability
Min. inner line width/spacing 0.075/0.075mm(3/3mil)
Min. spacing from hole edge to conductive 0.2mm(8mil)
Min. inner layer annular ring 0.1mm(4mil)
Min. inner layer isolation clearance 0.25mm(10mil) standard, 0.2mm(8mil) advanced
Min. spacing from board edge to conductive 0.2mm(8mil)
Min. gap width between copper ground 0.127mm(5mil)?
Unbalance copper thickness for inner core H/1oz, 1/2oz
Max. finished copper thickness 5oz
Outer layer Process Capability
Min. outer line width/spacing 0.075/0.075mm(3/3mil)
Min. hole pad size 0.3mm(12mil)
Process Capability
Max. slot tenting size 5 x 3mm(196.8 x 118mil)
Max. tenting hole size 4.5mm(177.2mil)
Min. tenting land width 0.2mm(8mil)
Min. annular ring 0.1mm(4mil)
Min. BGA pitch 0.5mm(20mil)
AOI
Machine Capability
Orbotech SK-75 AOI Material thickness: 0.05 ~ 6.0mm(2 ~ 236.2mil)
Material size: max. 597 ~ 597mm(23.5 x 23.5")
Orbotech Ves Machine Material thickness: 0.05 ~ 6.0mm(2 ~ 236.2mil)
Material size: max. 597 ~ 597mm(23.5 x 23.5")
Drilling
Machine Capability
MT-CNC2600 Drill machine Material thickness: 0.11 ~ 6.0mm(4.33 ~ 236mil)
Material size: max. 470 ~ 660mm(18.5 x 26")
Min. drill size: 0.2mm(8mil)
Process Capability
Min. multi-hit drill bit size 0.55mm(21.6mil)
Max. aspect ratio(finished board size VS Drill size) 12:1
Hole location tolerance(compared with CAD) +/-3mil
Counterbore hole PTH&NPTH, Top angle 130°,Top diameter <6.3mm
Min. spacing from hole edge to conductive 0.2mm(8mil)
Max. drill bit size 6.5mm(256mil)
Min. multi-hit slot size 0.45mm(17.7mil)
Hole size tolerance for press fit +/-0.05mm(+/-2mil)
Min. PTH slot size tolerance +/-0.15mm(+/-6mil)
Min. NPTH slot size tolerance +/-2mm(+/-78.7mil)
Min. spacing from hole edge to conductive(Blind vias) 0.23mm(9mil)
Min. laser drill size 0.1mm(+/-4mil)
Countersink hole angle&Diameter Top 82,90,120°
Wet Process
Machine Capability
Panel&Pattern plating line Material thickness: 0.2 ~ 7.0mm(8 ~276mil)
Material size: max. 610 x 762mm(24 x 30")
Deburring Maching Material thickness: 0.2 ~ 7.0mm(8 ~276mil)
Material size: min. 203 x 203mm(8" x 8")
Desmear Line Material thickness: 0.2mm ~ 7.0mm(8 ~276mil)
Material size: max. 610 x 762mm(24 x 30")
Tin plating line Material thickness: 0.2 ~ 3.2mm(8 ~126mil)
Material size: max. 610 x 762mm(24 x 30")
Process Capability
Hole wall copper thickness average 25um(1mil) standard
Finished copper thickness ≥18um(0.7mil)
Min line width for etching marking 0.2mm(8mil))
Max.finished copper weight for inner&outer layers 6oz
Different copper thickness H/1oz, 1/2oz
Solder Mask& Silkscreen
Machine Capability
Scrubbing Machine Material thickness: 0.5 ~ 7.0mm(20 ~ 276mil)
Material size: min. 228 x 228mm(9 x 9")
Exposer Material thickness: 0.11 ~ 7.0mm(4.3 ~ 276mil)
Material size: max. 635 x 813mm(25 x 32")
Develop machine Material thickness: 0.11 ~ 7.0mm(4.3 ~ 276mil)
Material size: min. 101 x 127mm(4 x 5")
Color
Solder mask color Green, matte green, yellow, black, blue, red, white
Silkscreen color White, yellow, black, blue
Solder Mask Capability
Min. solder mask opening 0.05mm(2mil)
Max. plugged via size 0.65mm(25.6mil)
Min. width for line coverage by S/M 0.05mm(2mil)
Min. solder mask legends width 0.2mm(8mil) standard, 0.17mm(7mil) advanced
Min. solder mask thickness 10um(0.4mil)
Solder mask thickness for via tenting 10um(0.4mil)
Min. carbon oil line width/spacing 0.25/0.35mm(10/14mil)
Min. tracer of carbon 0.06mm(2.5mil)
Min. carbon oil line trace 0.3mm(12mil))
Min. spacing from carbon pattern to pads 0.25mm(10mil)
Min. width for peelable mask cover line/pad 0.15mm(6mil)
Min. solder mask bridge width 0.1mm(4mil))
Solder mask Hardness 6H
Peelable Mask Capability
Min. spacing from peelable mask pattern to pad 0.3mm(12mil))
Max. size for peelable mask tent hole(By screen printing) 2mm(7.8mil)
Max. size for peelable mask tent hole(By aluminum printing) 4.5mm
Peelable mask thickness 0.2 ~ 0.5mm(8 ~20mil)
Silkscreen Capability
Min. silkscreen line width 0.11mm(4.5mil)
Min. silkscreen line height 0.58mm(23mil)
Min. spacing from legend to pad 0.17mm(7mil)
Surface Finish
Surface Finish Capability
Max. gold finger length 50mm(2")
ENIG 3 ~ 5um(0.11 ~ 197mil) nickel, 0.025 ~ 0.1um(0.001 ~ 0.004mil) gold
gold finger 3 ~ 5um(0.11 ~ 197mil) nickel, 0.25 ~ 1.5um(0.01 ~ 0.059mil) gold
HASL 0.4um(0.016mil) Sn/Pb
HASL Machine Material thickness: 0.6 ~ 4.0mm(23.6 ~ 157mil)
Material size: 127 x 127mm ~ 508 x 635mm(5 x 5" ~ 20 x 25")
Hard gold plating 1-5u"
Immersion Tin 0.8 ~ 1.5um(0.03 ~ 0.059mil) Tin
Immersion Silver 0.1 ~ 0.3um(0.004 ~ 0.012mil) Ag
OSP 0.2 ~ 0.5um(0.008 ~ 0.02mil)
E-Test
Machine Capability
Flying probe tester Material thickness: 0.4 ~ 6.0mm(15.7 ~ 236mil)
Material size: max. 498 x 597mm(19.6 ~ 23.5")
Min. spacing from test pad to board edge 0.5mm(20mil)
Min. conductive resistance
Max. insulation resistance 250mΩ
Max. test voltage 500V
Min. test pad size 0.15mm(6mil))
Min. test pad to pad spacing 0.25mm(10mil)
Max. test current 200mA
Profiling
Machine Capability
Profiling type NC routing, V-cut, slot tabs, stamp hole
NC routing machine Material thickness: 0.05 ~ 7.0mm(2 ~ 276mil)
Material size: max. 546 x 648mm(21.5 x 25.5")
V-cut machine Material thickness: 0.6 ~ 3.0mm(23.6 ~ 118mil)
Max material width for V-cut: 457mm(18")
Process Capability
Min. routing bit size 0.6mm(23.6mil)
Min. outline tolerance +/-0.1mm(+/-4mil)
V-cut angle type 20°, 30°, 45°, 60°
V-cut angle tolerance +/-5°
V-cut registration tolerance +/-0.1mm(+/-4mil )
V-cut web thickness tolerance +/-0.05mm(+/-2mil)
Min. gold finger spacing +/-0.15mm(+/-6mil)
Min. spacing to avoid gold finger tab bevelled +/-0.17mm(+/-7mil)
Bevelling angle tolerance +/-5°
Bevelling remain thickness tolerance +/-0.127mm(+/-5mil)
Min. inner radius 0.4mm(15.7mil)
Min. spacing from conductive to outline 0.2mm(8mil)
Countersink/Counterbore depth tolerance +/-0.1mm(+/-4mil)