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层数/ Layers：2-Layers FR4 板厚/ Thickness: 1.6mm 最小孔径/ Min.Hole Size: 0.15mm 线宽线距/ Width/Spacing：3.0/3.0mil 表面处理/ Surface Treatment: ENIG 特殊工艺/ Special Process：Special impedance 应用领域/ Appilcation: Security systems |
Technology Introduction
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层数/ Layers：2-Layers FR4 板厚/ Thickness: 1.6mm 最小孔径/ Min.Hole Size: 0.15mm 线宽线距/ Width/Spacing：3.0/3.0mil 表面处理/ Surface Treatment: ENIG 特殊工艺/ Special Process：Special impedance 应用领域/ Appilcation: Security systems |
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