层数/Layers:16-Layers FR4 HTG175 板厚/Thickness: 3.0mm 最小孔径/Min.Hole Size: 0.35mm 线宽线距/Width/Space:3.5/3.5mil 表面处理/Surface Treatment : ENIG 特殊工艺/Special Process:Gold Finger 应用领域/Appilcation:Antenna Systems |
Technology Introduction
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层数/Layers:16-Layers FR4 HTG175 板厚/Thickness: 3.0mm 最小孔径/Min.Hole Size: 0.35mm 线宽线距/Width/Space:3.5/3.5mil 表面处理/Surface Treatment : ENIG 特殊工艺/Special Process:Gold Finger 应用领域/Appilcation:Antenna Systems |
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