Double Side PCB

层数/ Layers：2-Layers FR4
板厚/ Thickness: 1.6mm
最小孔径/ Min.Hole Size: 0.15mm

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Multilayer PCB

层数/Layers：16-Layers FR4 HTG175
板厚/Thickness: 3.0mm
线宽线距/Width/Space：3.5/3.5mil

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HDI PCB

层数/Layers：12Layers 1+1+N+1+1
板厚/Thickness: 2mm
最小孔径/Min.Laser Via Size: 0.10mm

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Halogen Free PCB

层数/Layers:10 Layers FR4 HF
表面处理/Surface Treatment: ENIG
特殊工艺/Special Process:Impedance

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High Frequency PCB

层数/Layers：4-Layers FR4 (RO4350B)
板厚/Thickness: 1.0mm
最小孔径/Min.Hole Size: 0.20mm

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Heavy Copper PCB

层数/Layers：4Layers FR4 5OZ
线宽线距/Width/Space：8.0/8.0mil
特殊工艺/Special Process:Copper 5oz

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Backplane PCB

层数/ Layers：6 Layers FR4 TG175
板厚/ Board Thickness: 8.0mm
压接孔/Press Fit Hole Size: 0.3mm

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MCPCB

层数/Layers：2Layers (Aluminum)
板厚/Thickness: 2mm
特殊/Special Process：CounterSink

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2-Layers FPC

层数/Layers：2-Layers FPC
板厚/Thickness: 0.2mm
补强/Stiffeners：Polyimide, FR4, Steel

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Rigid-Flex PCB

层数/Layers：2L FPC+6L Rigid
线宽线距/Width/Spacing：3.0/3.0mil
特殊/Special Process：HDI 1+N+1

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